Sensata Technologies
Gigavac GR5LTA335 HV Relay
Product Code:GR5LTA335
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Product Description
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Gigavac GR5LTA335 HV Relay
Gigavac GR5LTA335 High Voltage Relay - 7kV / 5A
The **Gigavac GR5LTA335** is an ultra-high reliability Single Pole Double Throw (SPDT) reed relay, specifically engineered for applications demanding extreme longevity and precision. Featuring an industry-leading mechanical life of **one billion cycles**, this relay handles peak voltages up to **10kV** and a continuous carry current of **5 Amps**. With its rapid **2ms** operate and release times, the GR5LTA335 is the premier solution for automated test equipment (ATE), high-density signal switching, and medical electronics where millisecond-level timing and multi-decade durability are essential.
Product Highlights
- Extreme Longevity: Rated for an extraordinary 1,000,000,000 mechanical cycles
- High Isolation: 7kV Voltage Rating with 10kV Peak (DC or 60Hz) capability
- SPDT Configuration: Versatile Single Pole Double Throw (Form C) switching
- High Speed: Symmetrical 2ms operate and release times for precise control
- Signal Integrity: Low and stable contact resistance (0.250 Ohms max)
- Compact Reed Design: Ideal for high-density PCB layouts
Fields of Use
- Automated Test Equipment (ATE) Switching Matrix
- Precision Instrumentation and Measurement
- Medical Diagnostic and Laboratory Systems
- High-Voltage Power Supply Control
- Semiconductor Production and Testing
- Communication and RF Signal Management
Technical Specifications
| Contact Arrangement | Single Pole Double Throw (SPDT) |
|---|---|
| Voltage Rating (Working) | 7 kV |
| Rated Voltage (Peak) | 10 kV Peak (DC or 60Hz) |
| Max Carry Current | 5 Amps (DC or 60Hz) |
| Max. Contact Resistance | 0.250 Ohms |
| Max Operate Time | 2 ms |
| Max Release Time | 2 ms |
| Mechanical Life | 1,000,000,000 Cycles |
| Technology Type | Ultra-Long Life Reed Relay |
Technical Datasheet
Download the official Gigavac GR5LTA335 datasheet for complete technical documentation, including mounting blueprints, reliability data, and PCB footprints.